#5454220
Thermal pad standard DEXP
[35 × 35 × 0.5 mm (1 pcs), 6 W/mK] details
Not on sale
Characteristics Thermal pad standard DEXP
General parameters
Type
thermal pad
Model
DEXP
Type
standard
Material
standard (polymer)
Thermal Interface Specifications
Thermal Conductivity
6 W/mK
Thermal Pads Size
35 × 35 × 0.5 mm
Quantity Included
1 pcs
Density
2.8 g/cm³
Additional Information
Packaging
cardboard box
Description
The DEXP thermal pad is used for cooling printed circuit board chips in various devices. The dimensions of the item are 35x35x0.5 mm. The thermal conductivity of the DEXP thermal pad is 6 W/(m·K). Package quantity is 1. Pad density is 2.8 g/cm³.