CPU cooler DEEPCOOL AG400 G2 [R-AG400-BKNPMG2-G] black

#5653601

CPU cooler DEEPCOOL AG400 G2 [R-AG400-BKNPMG2-G] black

[fan- 120 x 120 mm, to 2200 RPM, base - aluminum/copper, heat tubes - 4 x 6 mm, 29.22 dB, 4 pin, 230 W] details

Not on sale

Accessories

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  • Instructions and files

Characteristics CPU cooler DEEPCOOL AG400 G2 [R-AG400-BKNPMG2-G] black

General parameters

Type
CPU cooler
Model
DEEPCOOL AG400 G2
Manufacturer Code
[R-AG400-BKNPMG2-G]
Socket
AM5, LGA 1851, LGA 1700, AM4
Thermal Design Power
230 W
Construction Type
tower

Radiator

Base Material
aluminum/copper
Heatsink Material
aluminium
Number of Heat Pipes
4
Heat Pipe Diameter
6 mm
Nickel Plating
heat pipes
Radiator Color
silver

Fan

Number of Fans Included
1
Max Mountable Fan Limit
1
Included Fan Sizes
120 x 120 mm
Frame Color
black
Fanblades Color
black
Fan Connector
4 pin
Max RPM
2200 RPM
Minimum Rotational Speed
500 RPM
Rotation Speed Control
automatic (PWM)
Max Air Flow
70.09 CFM
Max Static Pressure
24.4 Pa
Max Noise Level
29.22 dB
Rated Current
0.18 A
Rated Voltage
12 V
Bearing Type
slip (hydrodynamic)

Additional Information

Thermal Paste Included
in a separate container
LCD Screen
none
Backlight Type
none
Additional Information
direct contact of heat pipes
Package Contents
documentation, fastener kit

Dimensions and Weight

Height
152 mm
Width
125 mm
Length
92 mm
Weight
631 g

Description

The DEEPCOOL AG400 G2 CPU cooler [R-AG400-BKNPMG2-G] in black finish is equipped with a copper-aluminum base, a compact aluminum heatsink, and 4 heat pipes with a diameter of 6 mm. The heat pipes transfer heat from the CPU heat spreader to the heatsink surface for dissipation. To improve heat dissipation, the heat pipes form a single flat surface in the contact area with the CPU lid.
The DEEPCOOL AG400 G2 [R-AG400-BKNPMG2-G] tower CPU cooler is universal and compatible with various socket types: AM4, AM5, LGA 1700, and LGA 1851. The cooling module design includes one 120 mm fan with PWM speed control. The component comes with a syringe of thermal paste to be applied to the CPU lid before installing the module.