CPU Intel Core Ultra 5 245K OEM

#5601984

CPU Intel Core Ultra 5 245K OEM

[LGA 1851, 6P x 4.2 GHz, 8E x 3.6 GHz, L2 - 26 MB, L3 - 24 MB, 2 х DDR5-6400 MHz, Intel Graphics, TDP 159 W] details

3 190 000 UZS
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Integrated graphics core
Warranty: 12 mos.

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Characteristics CPU Intel Core Ultra 5 245K OEM

General parameters

Model
Intel Core Ultra 5 245K
Socket
LGA 1851
Manufacturer Code
[AT807680640F]
Release Year
2024
Cooling System Included
none
Thermal Interface Material Included
none

Core and Architecture

Total Number of Cores
14
Number of Performance Cores
6
Number of Efficiency Cores
8
Max CPU Threads
14
L2 Cache Size
26 MB
L3 Cache Size
24 MB
Technical Process
TSMC N3B
Core
Intel Arrow Lake-S

Frequency and Overclocking Capability

CPU Base Clock
4.2 GHz
Max Turbo Boost Clock
5.2 GHz
Efficient Cores Base Clock
3.6 GHz
Efficient Cores Turbo Clock
4.6 GHz
Unlocked Multiplier
yes

RAM Parameters

Memory Type
DDR5
Max RAM Memory Support
192 GB
Channel Count
2
RAM Frequency
DDR5-6400
ECC Mode Support
yes

Thermal characteristics

Thermal Design Power (TDP)
159 W
Base Thermal Design Power (TDP Rating)
125 W
Max CPU Temperature
105 °С

Graphics Core

Integrated Graphics
yes
GPU Series
Intel Graphics
GPU Max Clock Speed
1900 MHz

Bus and Controllers

Integrated PCIe Controller
PCIe 5.0
PCIe Lane Count
24 pcs

Additional Information

Virtualization
yes
Features, Additional
Intel AI Boost technology, Intel GNA technology

Description

The Intel Core Ultra 5 245K OEM processor connects to the motherboard socket via an LGA 1851 socket. Featuring a base clock speed of 4.2 GHz, this 14-core component supports overclocking, boosting frequencies up to 5.2 GHz. Thanks to integrated Intel Graphics with a clock speed of up to 1900 MHz, the CPU can be used in a build without a dedicated graphics card.

The Intel Core Ultra 5 245K OEM desktop processor for gaming is designed for DDR5 memory. Compatible memory with a capacity of up to 192 GB can operate at speeds up to 6400 MHz. The base processor power (TDP) is 125 W. This specification must be considered when choosing a compatible cooling system for the module.