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Thermal paste DEEPCOOL DS7 [R-DS7-GY055C-G]
[syringe, 5.5 g, 6.9 W/mK] details
99 000 UZS
Characteristics Thermal paste DEEPCOOL DS7 [R-DS7-GY055C-G]
General parameters
Type
thermal paste
Model
DEEPCOOL DS7
Manufacturer Code
[R-DS7-GY055C-G]
Weight
5.5 g
Thermal Interface Specifications
Thermal Conductivity
6.9 W/mK
Thermal Paste Packaging
syringe
Max Working Temperature
125 °С
Min Operating Temperature
-20 °С
Description
The DEEPCOOL DS7 [R-DS7-GY055C-G] thermal paste is designed for heat dissipation from processors or graphics cards of various models. The consumable accessory comes in a syringe for even application onto component surfaces. The operating temperature can range from -20 to +125 °C.
The volume of the DEEPCOOL DS7 [R-DS7-GY055C-G] thermal paste is 5.5 ml. Using the compound prevents the processor and graphics card from overheating. After application, the paste reduces surface temperature. Thermal conductivity reaches 6.9 W/mK.
The volume of the DEEPCOOL DS7 [R-DS7-GY055C-G] thermal paste is 5.5 ml. Using the compound prevents the processor and graphics card from overheating. After application, the paste reduces surface temperature. Thermal conductivity reaches 6.9 W/mK.