CPU Intel Core i7-13700F OEM

#5099223

CPU Intel Core i7-13700F OEM

[LGA 1700, 8P x 2.1 GHz, 8E x 1.5 GHz, L2 - 24 MB, L3 - 30 MB, 2 х DDR4, DDR5-5600 MHz, TDP 219 W] details

4 290 000 UZS
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Integrated graphics core
Warranty: 12 mos.

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Characteristics CPU Intel Core i7-13700F OEM

General parameters

Model
Intel Core i7-13700F
Socket
LGA 1700
Manufacturer Code
[CM8071504820806]
Release Year
2023
Cooling System Included
none
Thermal Interface Material Included
none

Core and Architecture

Total Number of Cores
16
Number of Performance Cores
8
Number of Efficiency Cores
8
Max CPU Threads
24
L2 Cache Size
24 MB
L3 Cache Size
30 MB
Technical Process
Intel 7
Core
Intel Raptor Lake-S

Frequency and Overclocking Capability

CPU Base Clock
2.1 GHz
Max Turbo Boost Clock
5.2 GHz
Efficient Cores Base Clock
1.5 GHz
Efficient Cores Turbo Clock
4.1 GHz
Unlocked Multiplier
none

RAM Parameters

Memory Type
DDR4, DDR5
Max RAM Memory Support
192 GB
Channel Count
2
RAM Frequency
DDR4-3200, DDR5-5600
ECC Mode Support
none

Thermal characteristics

Thermal Design Power (TDP)
219 W
Base Thermal Design Power (TDP Rating)
65 W
Max CPU Temperature
100 °С

Graphics Core

Integrated Graphics
none

Bus and Controllers

Integrated PCIe Controller
PCIe 5.0
PCIe Lane Count
20 pcs

Additional Information

Virtualization
yes
Features, Additional
Intel GNA technology

Description

The Intel Core i7-13700F processor opens up possibilities for building a powerful workstation or gaming system thanks to its 16-core configuration and 2.1 GHz clock frequency. The model easily handles multitasking due to its ability to simultaneously process up to 24 threads of information, provided by 8 performance cores. For accessing the most frequently requested data, the chipset features L2 and L3 cache sizes of 24 MB and 30 MB, respectively.
Based on the Intel Raptor Lake-S architecture, the Intel Core i7-13700F processor supports automatic clock speed boosting up to 5.2 GHz and DDR4/DDR5 RAM installations up to 192 GB. The 10-nanometer Intel 7 manufacturing process ensures high performance and energy efficiency for the chipset. The base power consumption of the device does not exceed 65 W, with a maximum operating temperature reaching up to 100 °C.