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RAM ADATA XPG Lancer [AX5U6000C3032G-DCLAWH] 64 GB
[DDR5, 32 GBx2 pcs, 6000 MHz, 30(CL)-40-40] details
Not on sale
Characteristics RAM ADATA XPG Lancer [AX5U6000C3032G-DCLAWH] 64 GB
General parameters
Type
RAM
Model
ADATA XPG Lancer
Manufacturer Code
[AX5U6000C3032G-DCLAWH]
Kit volume and contents
Memory Type
DDR5
Memory Module Type
UDIMM
Total Memory Capacity of the Entire Set
64 GB
Single Memory Module Capacity
32 GB
Number of Modules Included
2 pcs
Registered Memory
none
ECC Memory
none
Performance
Clock Frequency
6000 MHz
AMD EXPO Profiles
6000 MHz (30-40-40)
Intel XMP Profiles
6000 MHz (30-40-40)
Timings
CAS Latency (CL)
30
RAS to CAS Delay (tRCD)
40
Row Precharge Delay (tRP)
40
Design
Heatsink Present
yes
Radiator Color
white
Backlit Board Elements
none
Height
40 mm
Low Profile
none
Additional Information
Power Supply Voltage
1.35 V
Features, Additional
On-Die ECC
Description
ADATA XPG Lancer [AX5U6000C3032G-DCLAWH] RAM in a white design is tailored for high-performance gaming desktop PCs. The 64 GB kit includes two 32 GB DDR5 modules with a clock frequency of 6000 MHz and 30-40-40 timings. In-game performance is enhanced by XMP 3.0 and AMD EXPO overclocking technologies.
The bandwidth of ADATA XPG Lancer [AX5U6000C3032G-DCLAWH] RAM ensures high data transfer speeds between the CPU and other PC components across any software and operating systems. The kit is suitable for building and upgrading powerful, versatile office and home PCs. On-Die ECC technology prevents software crashes and improves system stability. Device compatibility with motherboards and CPUs is broadened with support for frequencies starting from 4800 MHz.
The memory supply voltage is increased to 1.35 V. Heat sinks prevent module overheating. Power Management IC technology optimizes power consumption. A module height of 40 mm prevents clearance issues when selecting a CPU cooler.
The bandwidth of ADATA XPG Lancer [AX5U6000C3032G-DCLAWH] RAM ensures high data transfer speeds between the CPU and other PC components across any software and operating systems. The kit is suitable for building and upgrading powerful, versatile office and home PCs. On-Die ECC technology prevents software crashes and improves system stability. Device compatibility with motherboards and CPUs is broadened with support for frequencies starting from 4800 MHz.
The memory supply voltage is increased to 1.35 V. Heat sinks prevent module overheating. Power Management IC technology optimizes power consumption. A module height of 40 mm prevents clearance issues when selecting a CPU cooler.