![RAM Patriot Signature Line [PSD34G13332] 4 GB](https://c.dns-shop.ru/thumb/st1/fit/500/500/258aca6569753b60367c51ceacc5136a/q85_f062ca0a90b1f5829358181ff37729196879dee26f3cb859f404cf170c8af29f.jpg)
#1099676
RAM Patriot Signature Line [PSD34G13332] 4 GB
[DDR3, 4 GBx1 pcs, 1333 MHz, 9(CL)-9-9-24] details
Not on sale
Characteristics RAM Patriot Signature Line [PSD34G13332] 4 GB
General parameters
Type
RAM
Model
Patriot Signature Line
Manufacturer Code
[PSD34G13332]
Kit volume and contents
Memory Type
DDR3
Memory Module Type
UDIMM
Total Memory Capacity of the Entire Set
4 GB
Single Memory Module Capacity
4 GB
Number of Modules Included
1 pcs
Registered Memory
none
ECC Memory
none
Performance
Clock Frequency
1333 MHz
Timings
CAS Latency (CL)
9
RAS to CAS Delay (tRCD)
9
Row Precharge Delay (tRP)
9
Activate to Precharge Delay (tRAS)
24
Design
Heatsink Present
none
Backlit Board Elements
none
Height
31 mm
Low Profile
none
Additional Information
Power Supply Voltage
1.5 V
Description
4-gigabyte DDR3 Patriot [PSD34G13332] memory will be useful when used in productive office and home computers. The memory module operates at a clock frequency of 1333 MHz. Supported frequencies are 800 MHz and 1066 MHz. The bandwidth of the device is 10600 MB/s. The height of the memory module is 31 mm. The model corresponds to the DDR3 type.
Patriot [PSD34G13332] memory is characterized by timings of 9-9-9-24. The supply voltage of the model is 1.5 V. The module is supplied in traditional packaging made of transparent plastic. The module and the packaging bear stickers containing brief information about the memory’s technical characteristics. The packaging of the device has a hole designed for storing the memory module on vertical surfaces.
Patriot [PSD34G13332] memory is characterized by timings of 9-9-9-24. The supply voltage of the model is 1.5 V. The module is supplied in traditional packaging made of transparent plastic. The module and the packaging bear stickers containing brief information about the memory’s technical characteristics. The packaging of the device has a hole designed for storing the memory module on vertical surfaces.