Thermal paste DEEPCOOL DS9 [R-DS9-GY050C-G]

#5496082

Thermal paste DEEPCOOL DS9 [R-DS9-GY050C-G]

[syringe, 5 g, 6.5 W/mK] details

95 000 UZS
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Warranty: 6 mos.
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Characteristics Thermal paste DEEPCOOL DS9 [R-DS9-GY050C-G]

General parameters

Type
thermal paste
Model
DEEPCOOL DS9
Manufacturer Code
[R-DS9-GY050C-G]
Weight
5 g

Thermal Interface Specifications

Thermal Conductivity
6.5 W/mK
Thermal Paste Packaging
syringe
Max Working Temperature
120 °С
Min Operating Temperature
-40 °С

Description

DEEPCOOL DS9 thermal paste will provide enhanced thermal conductivity of 6.5 W/mK, which allows it to transfer heat from powerful CPUs, GPUs, and other PC components. Thanks to its formulation, the paste remains plastic, ensuring long service life. It does not harden on the surface of components and does not damage them. The working temperature range of the paste is from –40 to 120 °C.
DEEPCOOL DS9 thermal paste is housed in a syringe, which provides convenient storage and transportation. The slim nozzle of the syringe allows you to extract an exact amount of paste. It can be evenly spread over the surface of the element with a rubber spatula, which is included in the kit. An alcohol wipe will help pre-degrease this surface.